Flo-master SMD 5000

Overview

The Flo-Master BGA/SMT rework and repair engine is a fully integrated dual, top and bottom heat system designed to handle BGA’s, military-type boards, and commercial applications requiring an efficient level of power vs. temperature.

Improved Alignment

Research has verified that increasing the available power during reflow has two significant effects:

• Increased Power availability reduces the necessary air temperature needed to Reflow.
• A reduction in Reflow Temperature results in higher solder viscosity, producing improved alignment characteristics for BGA and SMT components.

These two important effects produce the following important advantages:

• Reduced component and board stress
• Prevent the possibility of scorching
• Assist in the prevention of bridging between contacts
• Help align BGA components more comfortably

Benefits:

• Enables true reverse manufacture rework
• Low Temperature removal of components
• Maintains integrity of existing solder
• Automatic removal of components at eutectic stage
• All types of PCB products accommodated
• Total area, simultaneous reflow of component
• Run continuous or pulsed
• Rework soft plastics and sensitive components requiring short heat cycles.

Linear Air Delivery

The Heat Acceleration Chamber and delivery Nozzle Block are designed to provide maximum air spin of the air flow to the nozzle, ensuring minimal temperature differences across wide area packages, important for linear reflow of CCBGA and larger devices.

Specifications:

Preheat

Power: 110V–1800 Watts, 220V–2400 Watts
Current: 16.36 Amps @ 110V, 10.91 Amps @ 220V
Dimension: 26" x 12.75" x 16" (660 x 324 x 406 mm)
Board Holder: Standard 8” x 8” (203 x 203 mm)
Reflow Nozzles included: (User may select alternatives)
8100-0000-44 0.80" x 0.80" (20.3 x 20.3 mm)
8100-1424 0.71" x 0.40" (18.0 x 10.2 mm)
8100-0132 1.20" x 1.20" (30.5 x 30.5 mm)
8100-1414 1.40" x 1.40" (35.6 x 35.6 mm)
8100-0000-20 0.50" x 0.50" (12 x 12.7 mm)
8100-0000-68 1.10" x 1.10" (28.0 x 28.0 mm)
Preheat Nozzles: (Fixed Selection)
8100-2222P 2.00" x 2.00" (50.8 x 50.8 mm)
8100-0340P 1.62" x 1.62" (41.1 x 41.1 mm)
8100-0196P 1.50" x 1.50" (38.1 x 38.1 mm)
8100-1313P 1.30" x 1.30" (33.0 x 33.0 mm)
Temperature: Celsius or Fahrenheit
Air Velocity: (Both Heaters) <12.7 CFM
Vacuum: Internal (Optional factory Air)
Air Source: Internal
Controller (Both Heaters): Fuzzy logic PID Profile Storage
4-Axis X-Y Table Built In: 19.0" x 15.50" (482.6 x 393.7 mm)
Operation: Pulsed or Continuous
Maximum Board Size: 32" x 24"

A bottom preheat and in-process heat source, ensures stability of board temperature, reducing the necessary top reflow temperature, thereby following a more precise profile structure for the component undergoing rework.

Temperature Profiles

A range of temperature profiles are installed for bottom and top controllers and each thermal profile may be custom programmed, enabling different combinations of preheat and removal temperatures to be selected.

Mechanical Control

The Flo-Master has been engineered to operate on a standard workbench and includes a built-in X-Y Table for precise alignment. Each of the axis can be locked for optimum control.