- HSC, Mylar, PCMCIA
soldering connections
- Microprocessor
controlled
- Self-contained, no
PC or factory air required
- Linear pressure
control
- Precise
temperature control with ramping
- Repeatable process
control
- Continuous or
pulse operation
- Prestored profile
groups (User Programmable)
- Floating and
self-aligning bonding head
- Thermal bonding
reservoir
- "Super
Flat" bonding surface
- Thermal Stability
throughout bonding cycle
- No silicone
barrier required
|
- Ramp rate
degrees/sec
- Ramp rate time vs.
Temp
- Programmable set
point Centigrade or Fahrenheit
- Ramp time 45 sec
to 20 sec
|
