1. While the board is still warm, use the Probe #3 supplied with the SMD Tool Kit to scrape the coating from the center of the chip area, as shown. Be sure to use the knife edge side and take care not to damage the solderable pads themselves.

2. Use the Probe #1 to scrape the residual coating from between the pads; again be careful not to damage the pads themselves.

3. Use the Pad Prep supplied in the SMD Tool Kit to complete coating removal from the pads themselves by rubbing the pad prep lengthwise between the pads until all traces of coating material are removed.

4. After cleaning, place a small amount of Pad Prep solution on the cleaned pads.

Reinstallation of Components

1. Hot air level the pads. In most instances, sufficient solder will remain on the pads to attach a new chip; but the surface may be rough, uneven, or have solder "icicles", making accurate placement of a new chip impossible. To hot air level, depress the foot pedal to begin the heating cycle. The GREEN display will begin counting DOWN to zero. The solder will melt and become smooth; the solder should cover the pad(s) completely, with a slight rounded "pillow" shape.

2. Remove the board and board holder assembly from beneath the Chipmaster nozzle (depress cylinder, slide holder and board out). Let the board cool to ambient temperature.

3. Using the white "No-Clean" flux and Amber needle supplied with the SMD Tool Kit, dispense a small drop of flux in the center of the pad area as shown. The flux will hold the chip component in place during reflow (melting) of the solder. This flux will dissipate, however, by the completion of the heating cycle.

4. Pick up a replacement chip using a vacuum wand and place and center the chip on the solderable pad(s).

5. Place the board itself under the nozzle of the Chipmaster, being careful to center the component under the nozzle as accurately as possible.

6. Press the INDEX key on the Chip[master, being careful to center the component under the nozzle as accurately as possible.

7. Depress the foot pedal to begin the heating cycle. When the time reaches zero, CONTINUE HEATING FOR AN ADDITIONAL FIVE SECONDS to ensure good solder wetting. The timer will not count the five seconds; the operator must do so, counting silently or out loud, "One thousand, two thousand, three thousand, etc."

8. Release the foot pedal to end the heating cycle, and, after a few seconds, remove the board from the Chipmaster work area.

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