1. While the board is still warm, use the Prep Pen (Motorola #66-80333E75) supplied with the SMD Tool Kit to clean pad area, as shown.

2. Using cleaning solution IPA (Motorola #01-80303E39) from the tool kit, continue to clean the area being careful not to damage the pads themselves.

3. After cleaning, place a small amount of "No Clean Flux" (Motorola #66-80333E71) on the cleaned pads.

Reinstallation of PA

1. Hot air level the pads. In most instances, sufficient solder will remain on the pads to attach a new PA; but the surface may be rough, uneven, or have solder "icicles", making accurate placement of a new PA impossible. To hot air level, depress the foot pedal to begin the heating cycle. The GREEN display will begin counting DOWN to zero. The solder will melt and become smooth; the solder should cover the pad(s) completely, with a slightly rounded "pillow" shape.

2. Remove the board and board holder assembly from beneath the Chipmaster nozzle (depress cylinder, slide holder and board out). Let the board cool to ambient temperature.

Note: If there is insufficient solder to cover the pad(s), add solder to the pad(s) using wire solder and a soldering iron. Apply a drop of Pad Prep Solution to the pad(s) first, and clean afterwards with Pad Prep Cleaner.

3. Using the white "No-Clean" (Motorola #66-80333E71) flux and Amber needle supplied with the SMD Tool Kit, dispense a small amount of flux on the PA pad area as shown.

4. Pick up a replacement PA using a vacuum wand from the tool kit and place and center the PA on the solderable pad(s). Be sure external leads align with pads.

5. Place the board itself under the nozzle of the Chipmaster, being careful to center the component under the nozzle as accurately as possible.

6. Press the INDEX key on the Chipmaster controller ONCE, and verify or enter the appropriate cycle time. The appropriate cycle time for installation is the removal time, plus 30 seconds, to ensure good solder wetting.

a) press ENTER; Cycle time is recorded in the memory - depress the foot pedal to review.

b) Press the INDEX key TWICE to return to the main menu.

7. Depress the foot pedal to begin the heating cycle, until the timer reaches zero.

8. Release the foot pedal to end the heating cycle, and, after red temperature LED indicates 140°F., remove the board from the Chipmaster work area.